PLEASE NOTE: For official information, specific details, and updated deadlines and instructions, please check the organization’s website and current application forms. If you have any problems or questions, please contact us.
The U.S. Embassy Rangoon is pleased to announce the opportunity to compete for the Fulbright Foreign Student Scholarship Program for the academic year 2014-2015. The program gives full scholarship funding to Burmese students seeking a Master’s Degree at a university in the United States of America.
Participants will be recruited through a merit-based, open competition and chosen based upon their leadership potential, academic excellence, maturity, ability to adjust successfully to life in the U.S., and potential to promote mutual understanding between the United States and the people of other countries. Fulbright Foreign Student scholarships provide tuition and related academic fees, a monthly stipend for room, board and incidental expenses, supplemental health and accident benefits, a book and equipment allowance, travel allowance, and the opportunity to attend Fulbright enrichment activities.
To be eligible, applicants:
Important: All grantees are expected to return to their home countries for at least two years at the conclusion of their grant in compliance with the J-visa requirements.
The deadline for applications is July 3, 2013
The application and detailed instructions are available at: http://burma.usembassy.gov/scholarships.html or the Cultural Affairs Unit, Public Affairs Section, American Embassy, 110 University Avenue, Kamayut Township, Rangoon, Ph: 536509/ 505113 Ext: 4369, email: RangoonUSECA@state.gov.
Fulbright Informational sessions in Rangoon:
Dates: Friday, April 5, 2013
Friday, May 3, 2013
Friday, June 7, 2013
Time: 5:00 p.m.
Place: The American Center, 14 Tawwin Street, Dagon Township
Other informational sessions will be announced later.
Fulbright Application Form (Required) (PDF 298 K)
Supplemental Forms (Required)
Letter of Reference (PDF 68 K)
Academic Records Information Form (PDF 44 K)